The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11424223 B1

Date of Patent:

Aug. 23, 2022

Filed:

Nov. 12, 2019

Led lighting arrangement

Applicant:

Lumileds Llc, San Jose, CA (US);

Inventor:

Michael Deckers, Jülich, DE;

Assignee:

Lumileds LLC, San Jose, CA (US);

Attorney:

Volpe Koenig

Primary Examiner:

Samuel A Gebremariam

Int. Cl.

CPC ...

H01L 33/00 (2010.01); H01L 25/075 (2006.01); F21S 41/153 (2018.01); F21S 45/47 (2018.01); F21S 41/20 (2018.01); H01L 21/48 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01); H01L 25/16 (2006.01); H01L 33/60 (2010.01); H01L 33/62 (2010.01); H01L 33/64 (2010.01); F21Y 105/16 (2016.01); F21Y 103/10 (2016.01); F21Y 115/10 (2016.01); H01L 33/56 (2010.01);

U.S. Cl.

CPC ...

H01L 25/0753 (2013.01); F21S 41/153 (2018.01); F21S 41/285 (2018.01); F21S 45/47 (2018.01); H01L 21/486 (2013.01); H01L 23/49866 (2013.01); H01L 23/5384 (2013.01); H01L 23/5386 (2013.01); H01L 25/167 (2013.01); H01L 33/60 (2013.01); H01L 33/62 (2013.01); H01L 33/644 (2013.01); F21Y 2103/10 (2016.08); F21Y 2105/16 (2016.08); F21Y 2115/10 (2016.08); H01L 33/56 (2013.01); H01L 2933/0066 (2013.01); H01L 2933/0075 (2013.01);

Abstract

The invention describes an LED lighting arrangement comprising a single-layer carrier comprising a mounting surface, a metal core, and a dielectric layer between the mounting surface and the metal core; at least one LED string comprising a plurality of series-connected LED die packages mounted on the mounting surface, wherein the LED die packages of a string are arranged in a two-dimensional array comprising at least two rows; and at least one micro-via extending through the dielectric layer of the single-layer carrier and arranged to electrically connect the final cathode of an LED string to the metal core of the single-layer carrier. The invention further describes a lighting unit; and a method of manufacturing an LED lighting arrangement.

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