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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11424210 B1

PDFFull Text
Date of Patent:
Aug. 23, 2022

Filed:

Aug. 07, 2020

Light-emitting package

Applicant:

Xiamen San'an Optoelectronics Co., Ltd., Xiamen, CN;

Inventor:

Tsukasa Inoguchi, Kitakatsuragi-gun, JP;

Assignee:

Xiamen San'an Optoelectronics Co., Ltd., Xiamen, CN;

Attorney:

Morrison & Foerster LLP

Primary Examiner:

Jonathan Han

Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 25/075 (2006.01); H01L 33/62 (2010.01); H01L 33/48 (2010.01); H05B 33/06 (2006.01); H01L 25/16 (2006.01); H01L 33/60 (2010.01); H01L 33/64 (2010.01); H01L 33/46 (2010.01); H05B 45/56 (2020.01); F21V 8/00 (2006.01); H01L 33/56 (2010.01);
U.S. Cl.
CPC ...
H01L 24/48 (2013.01); G02B 6/0073 (2013.01); H01L 24/97 (2013.01); H01L 25/0753 (2013.01); H01L 25/167 (2013.01); H01L 33/486 (2013.01); H01L 33/56 (2013.01); H01L 33/60 (2013.01); H01L 33/62 (2013.01); H01L 33/64 (2013.01); H05B 33/06 (2013.01); H01L 24/45 (2013.01); H01L 33/46 (2013.01); H01L 33/641 (2013.01); H01L 2224/45015 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48106 (2013.01); H01L 2224/48227 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/14 (2013.01); H01L 2924/15787 (2013.01); H01L 2924/181 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/351 (2013.01); H05B 45/56 (2020.01);
Abstract

A light-emitting package includes a substrate having a mounting area, one or more light-emitting devices mounted on the mounting area of the substrate, a transparent resin section having a light transmitting property for sealing the one or more light-emitting devices, and a light-reflective member molded on one part of the substrate, which is outside the mounting area on which the one or more light-emitting devices are mounted. There is a distance greater than zero between the light-reflective member and the mounting area.

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Inoguchi, Tsukasa. (2022). Light-emitting package (U.S. Patent No. 11424210). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11424210

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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