The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 23, 2022
Filed:
Jul. 14, 2020
Applicant:
Mediatek Inc., Hsin-Chu, TW;
Inventors:
Po-Chao Tsao, Hsin-Chu, TW;
Yu-Hua Huang, Hsin-Chu, TW;
Assignee:
MEDIATEK INC., Hsin-Chu, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 24/05 (2013.01); H01L 24/03 (2013.01); H01L 2224/02205 (2013.01); H01L 2224/0311 (2013.01); H01L 2224/03614 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/05551 (2013.01); H01L 2224/05554 (2013.01); H01L 2224/05557 (2013.01);
Abstract
A semiconductor component is provided. The semiconductor component includes a substrate and a pad. The pad has an upper surface and a slot, wherein the slot is recessed with respect to the upper surface.