The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 23, 2022

Filed:

Feb. 21, 2019
Applicant:

Analog Devices, Inc., Norwood, MA (US);

Inventors:

John C. Mahon, Merrimack, NH (US);

Peter J. Katzin, Arlington, MA (US);

Song Lin, Burlington, MA (US);

Assignee:

Analog Devices, Inc., Norwood, MA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/66 (2006.01); H01L 23/48 (2006.01); H03H 7/38 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/66 (2013.01); H01L 23/481 (2013.01); H03H 7/38 (2013.01); H01L 24/32 (2013.01); H01L 2223/6655 (2013.01); H01L 2223/6672 (2013.01); H01L 2223/6683 (2013.01); H01L 2224/32227 (2013.01);
Abstract

An integrated circuit (IC) die is disclosed. The IC die can include a signal via extending through the IC die. The IC die can include a transmission line extending laterally within the IC die in a direction non-parallel to the signal via, the transmission line configured to transfer an electrical signal to the signal via. The IC die can include a matching circuit disposed between the transmission line and the signal via. The matching circuit can include inductance and capacitance matching circuitry to compensate for parasitic inductance and capacitance introduced by transition from the IC die to an underlying carrier.


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