The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 23, 2022
Filed:
Feb. 18, 2020
Applicant:
At&s (Chongqing) Company Limited, Chongqing, CN;
Inventor:
Jeesoo Mok, Chongqing, CN;
Assignee:
AT&S(Chongqing) Company Limited, Chongqing, CN;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); H05K 1/02 (2006.01); H05K 1/03 (2006.01); H05K 1/05 (2006.01); H05K 1/09 (2006.01); H05K 1/11 (2006.01); H05K 1/16 (2006.01); H05K 1/18 (2006.01); H05K 3/00 (2006.01); H05K 3/02 (2006.01); H05K 3/06 (2006.01); H05K 3/10 (2006.01); H05K 3/30 (2006.01); H05K 3/32 (2006.01); H05K 3/36 (2006.01); H05K 3/38 (2006.01); H05K 3/40 (2006.01); H05K 3/42 (2006.01); H05K 3/44 (2006.01); H05K 3/46 (2006.01); H01L 23/498 (2006.01); H01L 25/00 (2006.01); H01L 21/56 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49822 (2013.01); H01L 21/481 (2013.01); H01L 21/4857 (2013.01); H01L 21/56 (2013.01); H01L 23/49838 (2013.01); H01L 25/00 (2013.01); H01L 23/49816 (2013.01);
Abstract
A method of manufacturing a component carrier includes forming a stack with electrically conductive layer structures and at least one electrically insulating layer structure; configuring the stack as a redistribution structure for transferring between a smaller pitch on one side of the stack towards a larger pitch on an opposing other side of the stack; arranging a first stiffening structure and a second stiffening structure in opposing surface regions of the stack. A component carrier and an electric device manufactured with the method exhibit improved stiffness and signal integrity.