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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11424170 B1

PDFFull Text
Date of Patent:
Aug. 23, 2022

Filed:

Mar. 30, 2015

Method for mounting an electrical component in which a hood is used, and a hood that is suitable for use in this method

Applicant:

Siemens Aktiengesellschaft, Munich, DE;

Inventors:

Nora Busche, Berlin, DE;

Joerg Strogies, Berlin, DE;

Klaus Wilke, Berlin, DE;

Assignee:

SIEMENS AKTIENGESELLSCHAFT, Munich, DE;

Attorney:

Slayden Grubert Beard PLLC

Primary Examiner:

Mark W Tornow

Assistant Examiner:

Abbigale A Boyle

Int. Cl.
CPC ...
H01L 23/057 (2006.01); H01L 23/498 (2006.01); H01L 23/373 (2006.01); H01L 23/00 (2006.01); H01L 21/50 (2006.01); H01L 23/10 (2006.01); H01L 21/48 (2006.01); H01L 23/473 (2006.01);
U.S. Cl.
CPC ...
H01L 23/057 (2013.01); H01L 21/4875 (2013.01); H01L 21/4882 (2013.01); H01L 21/50 (2013.01); H01L 23/10 (2013.01); H01L 23/3731 (2013.01); H01L 23/3735 (2013.01); H01L 24/83 (2013.01); H01L 23/473 (2013.01); H01L 23/49833 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/33 (2013.01); H01L 24/75 (2013.01); H01L 2224/29111 (2013.01); H01L 2224/29116 (2013.01); H01L 2224/29294 (2013.01); H01L 2224/29339 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/33181 (2013.01); H01L 2224/753 (2013.01); H01L 2224/8382 (2013.01); H01L 2224/8384 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83439 (2013.01); H01L 2224/83444 (2013.01); H01L 2224/83447 (2013.01); H01L 2924/1033 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/10272 (2013.01); H01L 2924/10329 (2013.01); H01L 2924/15192 (2013.01); H01L 2924/165 (2013.01); H01L 2924/1679 (2013.01); H01L 2924/16152 (2013.01); H01L 2924/16235 (2013.01); H01L 2924/16251 (2013.01); H01L 2924/16787 (2013.01);
Abstract

A method for mounting an electrical component on a substrate is disclosed. According to the method, joining is simplified using a cover, or hood, that includes a contact structure on an inner side of the hood, wherein when the hood is mounted, the contact structure is joined to the underlying structure at different joining levels simultaneously using an additional material. Moreover, a joining pressure, e.g., for diffusion or sintered bonds for electrical contacts, can be applied using such a hood.

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