The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 23, 2022

Filed:

Sep. 09, 2020
Applicant:

Ablic Inc., Tokyo, JP;

Inventor:

Hideo Yoshino, Tokyo, JP;

Assignee:

ABLIC INC., Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01); H01L 27/06 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76834 (2013.01); H01L 21/76816 (2013.01); H01L 27/0629 (2013.01);
Abstract

A semiconductor device, including: a first semiconductor element formed at a first surface on a substrate, and has a first electrode portion formed thereon a first metal silicide film; a second semiconductor element formed at a second surface at a higher position than the first surface, and has a second electrode portion formed thereon a second metal silicide film and a hydrogen supply film configured to cover a part of an upper portion of the second metal silicide film; an interlayer insulating film formed on the first semiconductor element and the second semiconductor element; a first contact hole formed through the interlayer insulating film until the first metal silicide film; a second contact hole formed through the interlayer insulating film and the hydrogen supply film until the second metal silicide film; and a metal wiring embedded in each of the first contact hole and the second contact hole.


Find Patent Forward Citations

Loading…