The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 23, 2022

Filed:

Apr. 23, 2019
Applicant:

Ngk Insulators, Ltd., Nagoya, JP;

Inventor:

Hideaki Takasaki, Handa, JP;

Assignee:

NGK Insulators, Ltd., Nagoya, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/683 (2006.01); H01L 21/67 (2006.01); H01L 21/687 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6833 (2013.01); H01L 21/67109 (2013.01); H01L 21/6831 (2013.01); H01L 21/68757 (2013.01); H01L 21/68785 (2013.01);
Abstract

A semiconductor manufacturing apparatus member in which an insulating electrostatic chuck having a wafer placement surface and provided with a narrow hole and a conductive cooling plate provided with a gas supply hole are bonded together, the member includes a plug chamber composed of at least one of an electrostatic chuck side recess and a cooling plate side recess, a porous insulating air permeable plug disposed in the plug chamber, an annular dense layer provided on the surface of the air permeable plug so as to separate the surface of the air permeable plug into a narrow hole side surface and a gas supply hole side surface and an adhesive layer filled between the dense layer and the wall surface of the plug chamber.


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