The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 23, 2022
Filed:
Mar. 20, 2020
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Inventors:
Assignee:
SAMSUNG ELECTRONICS CO., LTD., Gyeonggi-Do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/321 (2006.01); H01L 21/768 (2006.01); H01L 21/288 (2006.01); C09G 1/04 (2006.01); C09K 3/14 (2006.01); B24B 37/04 (2012.01);
U.S. Cl.
CPC ...
H01L 21/3212 (2013.01); B24B 37/044 (2013.01); C09G 1/04 (2013.01); C09K 3/1409 (2013.01); H01L 21/2885 (2013.01); H01L 21/7684 (2013.01); H01L 21/76802 (2013.01); H01L 21/76834 (2013.01); H01L 21/76843 (2013.01); H01L 21/76877 (2013.01);
Abstract
A method of manufacturing a metal structure including forming a metal layer including a metal and a nano-abrasive and supplying slurry on the metal layer to perform chemical mechanical polishing, a metal structure including a metal and a nano-abrasive having an average particle diameter of less than about 5 nanometers, and a metal wire, a semiconductor device, and an electronic device including the same.
Quick Actions:
Takai, Kenji. (2022). Metal structure and method of manufacturing the same and metal wire and semiconductor device and electronic device (U.S. Patent No. 11424133). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11424133
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile