The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 23, 2022
Filed:
Jan. 10, 2019
Applicant:
Murata Manufacturing Co., Ltd., Kyoto-fu, JP;
Inventor:
Katsuhisa Imada, Nagaokakyo, JP;
Assignee:
Murata Manufacturing Co., Ltd., Kyoto-fu, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 27/28 (2006.01); H01F 27/24 (2006.01); H01F 41/04 (2006.01); H01F 27/29 (2006.01); H01F 17/00 (2006.01); H01F 17/04 (2006.01);
U.S. Cl.
CPC ...
H01F 27/2804 (2013.01); H01F 17/0013 (2013.01); H01F 17/04 (2013.01); H01F 27/24 (2013.01); H01F 27/29 (2013.01); H01F 27/292 (2013.01); H01F 41/041 (2013.01); H01F 41/043 (2013.01); H01F 41/046 (2013.01); H01F 2027/2809 (2013.01);
Abstract
A multilayer coil component includes a body including laminated ferrite layers, a coil conductor including conductive layers laminated in the body, and a pair of outer electrodes disposed on the lower surface of the body. Each of the pair of outer electrodes is electrically connected to a corresponding one of the end portions of the coil conductor. The lower surface of the multilayer coil component includes a recessed section between the pair of outer electrodes.