The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 23, 2022

Filed:

Jul. 25, 2018
Applicant:

Nextinput, Inc., Mountain View, CA (US);

Inventors:

Julius Minglin Tsai, San Jose, CA (US);

Dan Benjamin, Atlanta, GA (US);

Assignee:

Qorvo US, Inc., Greensboro, NC (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06K 9/00 (2022.01); G06V 40/13 (2022.01); G01L 1/16 (2006.01); G01L 1/18 (2006.01); G01L 1/20 (2006.01); G06F 3/041 (2006.01); G01L 1/22 (2006.01);
U.S. Cl.
CPC ...
G06V 40/1306 (2022.01); G01L 1/16 (2013.01); G01L 1/18 (2013.01); G01L 1/205 (2013.01); G01L 1/2293 (2013.01); G06F 3/041 (2013.01);
Abstract

Described herein is a ruggedized microelectromechanical ('MEMS') sensor including both fingerprint and force sensing elements and integrated with complementary metal-oxide-semiconductor ('CMOS') circuitry on the same chip. The sensor employs either piezoresistive or piezoelectric sensing elements for detecting force and also capacitive or ultrasonic sensing elements for detecting fingerprint patterns. Both force and fingerprint sensing elements are electrically connected to integrated circuits on the same chip. The integrated circuits can amplify, digitize, calibrate, store, and/or communicate force values and/or fingerprint patterns through output pads to external circuitry.


Find Patent Forward Citations

Loading…