The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 23, 2022

Filed:

Mar. 23, 2021
Applicant:

Impinj, Inc., Seattle, WA (US);

Inventors:

Ronald L. Koepp, Seattle, WA (US);

Harley K. Heinrich, Snohomish, WA (US);

Christopher J. Diorio, Shoreline, WA (US);

Tan Mau Wu, Seattle, WA (US);

Assignee:

Impinj, Inc., Seattle, WA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06K 19/077 (2006.01); H01L 21/768 (2006.01); H01L 23/528 (2006.01);
U.S. Cl.
CPC ...
G06K 19/07754 (2013.01); H01L 21/76802 (2013.01); H01L 21/76877 (2013.01); H01L 23/528 (2013.01);
Abstract

A Radio Frequency Identification (RFID) integrated circuit (IC) is at least partially covered by a repassivation layer that is, in turn, at least partially covered by a large, electrically conductive contact pad. The repassivation layer is disposed so as to leave uncovered at least one IC contact. The large contact pad is disposed so as to cover the IC IC contact. The large contact pad forms a first galvanic coupling to the IC contact and a second galvanic coupling to a tag antenna. The surface area of the first galvanic coupling is substantially smaller than the surface area of the second galvanic coupling.


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