The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 23, 2022

Filed:

Jan. 06, 2021
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Eric Marz, Williston, VT (US);

Kirk D. Peterson, Jericho, VT (US);

Greg Abrami, Essex Junction, VT (US);

Howard V. Mahaney, Jr., Cedar Park, TX (US);

William James Anderl, Rochester, MN (US);

Eric Jason Fluhr, Round Rock, TX (US);

Todd Jon Rosedahl, Zumbrota, MN (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G06F 1/20 (2006.01); G05B 17/02 (2006.01); G06F 1/324 (2019.01);
U.S. Cl.
CPC ...
G06F 1/206 (2013.01); G05B 17/02 (2013.01); G06F 1/324 (2013.01);
Abstract

Thermal control of a multi-chip module in an operating environment is facilitated by predetermining separate thermal control points for multiple chips of the multi-chip module, with a first chip and a second chip having different predetermined thermal control points, and saving the predetermined thermal control points for reference by a thermal control of the multi-chip module in an operating environment. The thermal control monitors an operating temperature of the first chip, and compares the operating temperature of the first chip to the predetermined thermal control point of that chip. The thermal control further initiates a control action to control temperature of the first chip based on comparing the operating temperature of the first chip to the predetermined thermal control point of the first chip.


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