The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 23, 2022
Filed:
Jul. 06, 2017
Applicant:
Toray Industries, Inc., Tokyo, JP;
Inventors:
Assignee:
Toray Industries, Inc., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/004 (2006.01); G03F 7/038 (2006.01); G03F 7/039 (2006.01); H01B 1/20 (2006.01); H01B 13/00 (2006.01); H05K 1/09 (2006.01); H05K 3/02 (2006.01); G06F 3/041 (2006.01); H01L 31/0224 (2006.01); H05B 33/02 (2006.01); H01B 5/14 (2006.01); H01B 1/22 (2006.01); G03F 7/40 (2006.01); H01L 27/146 (2006.01); H01L 51/00 (2006.01); H01L 51/50 (2006.01);
U.S. Cl.
CPC ...
G03F 7/004 (2013.01); G03F 7/0042 (2013.01); G03F 7/0043 (2013.01); G03F 7/0047 (2013.01); G03F 7/038 (2013.01); G03F 7/039 (2013.01); G03F 7/40 (2013.01); G06F 3/041 (2013.01); H01B 1/20 (2013.01); H01B 1/22 (2013.01); H01B 5/14 (2013.01); H01B 13/00 (2013.01); H01B 13/0036 (2013.01); H01L 31/0224 (2013.01); H05B 33/02 (2013.01); H05K 1/095 (2013.01); H05K 3/027 (2013.01); H01L 27/14636 (2013.01); H01L 27/14683 (2013.01); H01L 31/022425 (2013.01); H01L 51/0023 (2013.01); H01L 51/50 (2013.01); H05K 2201/0154 (2013.01); H05K 2201/0224 (2013.01);
Abstract
A photosensitive resin composition includes electrically conductive particles (A) whose surfaces are coated with a carbon simple substance and/or a carbon compound; an alkali-soluble resin (B) containing an acid-dissociation group; and a metal chelate compound (C) wherein the metal chelate compound (C) includes at least one selected from the group consisting of Au, Ag, Cu, Cr, Fe, Co, Ni, Bi, Pb, Zn, Pd, Pt, Al, Ti, Zr, W and Mo.