The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 23, 2022

Filed:

May. 28, 2019
Applicant:

Mellanox Technologies, Ltd., Yokneam, IL;

Inventors:

Konstantin Turchin, Yokneam Illit, IL;

Israel Dadon, Haifa, IL;

Ido Bourstein, Pardes Hana-Karkur, IL;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 1/04 (2006.01); G01R 31/28 (2006.01); G01R 1/073 (2006.01); G01R 31/26 (2020.01); G01R 31/3185 (2006.01);
U.S. Cl.
CPC ...
G01R 1/0433 (2013.01); G01R 1/07342 (2013.01); G01R 31/2601 (2013.01); G01R 31/2853 (2013.01); G01R 31/318513 (2013.01);
Abstract

An apparatus for testing an Integrated Circuit (IC) to be installed on a product substrate of a Multi-Chip Module (MCM) is disclosed. The apparatus includes a test substrate including (i) a first surface configured to receive the tested IC and at least an additional IC, (ii) a second surface that is opposite the first surface and is configured to receive electrical contacts, and (iii) first electrical traces for conveying electrical signals between the tested IC, the additional IC and the electrical contacts. The apparatus further includes a second electrical trace, which is formed in the test substrate instead of the additional IC and is configured to electrically connect between two of the first electrical traces.


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