The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 23, 2022
Filed:
Apr. 07, 2020
Applicant:
Infineon Technologies Ag, Neubiberg, DE;
Inventors:
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01P 3/44 (2006.01); H01L 25/16 (2006.01); H01L 23/62 (2006.01); H01L 49/02 (2006.01); H01L 23/31 (2006.01); G01D 5/14 (2006.01); G01D 5/16 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
G01P 3/44 (2013.01); G01D 5/142 (2013.01); G01D 5/16 (2013.01); H01L 23/3121 (2013.01); H01L 23/3135 (2013.01); H01L 23/62 (2013.01); H01L 25/16 (2013.01); H01L 28/40 (2013.01); H01L 24/48 (2013.01); H01L 2224/48106 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48245 (2013.01);
Abstract
A magnetic field sensor package comprises a chip carrier, a magnetic field sensor which is arranged on the chip carrier and designed to detect a magnetic field, an integrated circuit which is arranged on the chip carrier and designed to logically process sensor signals provided by the magnetic field sensor, and at least one integrated passive component which is electrically coupled to at least one of the magnetic field sensor or the integrated circuit.