The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 23, 2022

Filed:

Mar. 09, 2020
Applicant:

Ngk Insulators, Ltd., Nagoya, JP;

Inventors:

Yukio Miyairi, Nagoya, JP;

Takahiro Tomita, Nagoya, JP;

Megumi Fujisaki, Nagoya, JP;

Assignee:

NGK Insulators, Ltd., Nagoya, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F01N 3/022 (2006.01); F01N 13/18 (2010.01); F01N 3/021 (2006.01); F01N 3/023 (2006.01); F01N 3/035 (2006.01); B01D 46/24 (2006.01); B01D 46/84 (2022.01);
U.S. Cl.
CPC ...
F01N 3/0222 (2013.01); B01D 46/2422 (2013.01); B01D 46/2429 (2013.01); B01D 46/84 (2022.01); F01N 3/023 (2013.01); F01N 3/0211 (2013.01); F01N 3/035 (2013.01); F01N 13/1811 (2013.01); B01D 2279/30 (2013.01); F01N 2330/06 (2013.01); F01N 2330/30 (2013.01);
Abstract

A particulate filter, including: a pillar-shaped honeycomb structure portion having a plurality of first cells extending from a first end face to a second end face, the first end face being open and the second end face being plugged, and a plurality of second cells extending from the first end face to the second end face, the first end face being plugged and the second end face being open, in which the first cells and the second cells are alternately arranged adjacent to each other with porous partition walls interposed therebetween; and a low thermal conductive layer covering a part or the whole of an outer peripheral side surface of the pillar-shaped honeycomb structure portion, the thermal conductivity in a thickness direction of the low thermal conductive layer being 0.6 W/(m·K) or less.


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