The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 23, 2022
Filed:
Mar. 27, 2020
Nitto Denko Corporation, Ibaraki, JP;
Daisuke Hattori, Ibaraki, JP;
Ryota Morishima, Ibaraki, JP;
Atsushi Kishi, Ibaraki, JP;
Akiko Sugino, Ibaraki, JP;
NITTO DENKO CORPORATION, Ibaraki, JP;
Abstract
The present invention provides a laminate of a void-containing layer and a pressure-sensitive adhesive/adhesive layer that achieves both a pressure-sensitive adhesive force or an adhesive force and a reduction of a tendency of a pressure-sensitive adhesive or an adhesive to penetrate into voids. The first laminate of the present invention includes: a void-containing layer (); and a pressure-sensitive adhesive/adhesive layer (), wherein the pressure-sensitive adhesive/adhesive layer () is directly laminated on one or both sides of the void-containing layer (), the void-containing layer () has a void fraction of 35 vol % or more, and, after a heat/humidification durability test of holding at a temperature of 85° C. and a relative humidity of 85% for 500 hours, a void remaining ratio of the void-containing layer () is 50 vol % or more before the heat/humidification durability test.