The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 23, 2022
Filed:
Nov. 27, 2017
Applicant:
Hitachi, Ltd., Tokyo, JP;
Inventors:
Miki Hiraoka, Tokyo, JP;
Shinya Kawakita, Tokyo, JP;
Masayuki Kyoi, Tokyo, JP;
Osamu Ikeda, Tokyo, JP;
Assignee:
Hitachi, Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 3/00 (2006.01); B23K 3/06 (2006.01); B23K 3/02 (2006.01); B23K 3/04 (2006.01);
U.S. Cl.
CPC ...
B23K 3/0615 (2013.01); B23K 3/025 (2013.01); B23K 3/04 (2013.01);
Abstract
A soldering device capable of shortening operation time of soldering and suppressing solder non-wetting is provided. A soldering device includes: a plurality of tubular solder piece guide tubes which have space therein for a solder piece supplied from a supply port to pass through; a first holding unit which holds the solder piece guide tubes; and a heating unit which heats the first holding unit. Tip end portions of the solder piece guide tubes on a soldering side are arranged on an inner side of the first holding unit.