The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 16, 2022

Filed:

Apr. 02, 2019
Applicant:

Shanghai Data Center Science Co., Ltd, Shanghai, CN;

Inventors:

Jun Zhang, Shanghai, CN;

Bin Wang, Shanghai, CN;

Ting Zhao, Shanghai, CN;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/00 (2006.01); H05K 7/14 (2006.01); H05K 5/00 (2006.01);
U.S. Cl.
CPC ...
H05K 7/1487 (2013.01); H05K 5/0021 (2013.01); H05K 7/1495 (2013.01);
Abstract

Disclosed is a prefabricating and stacking combined data center. The data center is formed block structures in a multi-dimensional stacking manner. The block structures are disposed to be a fire protection layer, an air return layer, a bridge architecture wiring layer, a top-cabinet wiring layer, a cabinet device layer, and an air supply layer from up to down, which are independent from each other. Provided is a prefabricating and stacking combined data center. Operation difficulty of site construction is greatly reduced by prefabricating block structures by a factory, forming the data center by multi-dimensional stacking, and connecting the block structures with each other by splicing on site. In addition, according to different requirements of customers, corresponding ancillary facilities may be designed based on volume of an IT device, and the device and a computer room may be reasonably and effectively arranged according to the corresponding national standards and specifications.


Find Patent Forward Citations

Loading…