The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 16, 2022

Filed:

Sep. 23, 2016
Applicant:

Europlasma NV, Oudenaarde, BE;

Inventors:

Samir Loulidi, Oudenaarde, BE;

Eva Rogge, Oudenaarde, BE;

Filip Legein, Oudenaarde, BE;

Assignee:

EUROPLASMA NV, Oudenaarde, BE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B05D 1/00 (2006.01); B05D 3/14 (2006.01); H05K 3/28 (2006.01); C23C 16/30 (2006.01); B05D 5/08 (2006.01);
U.S. Cl.
CPC ...
H05K 3/282 (2013.01); B05D 1/62 (2013.01); B05D 3/145 (2013.01); C23C 16/30 (2013.01); H05K 3/285 (2013.01); B05D 5/08 (2013.01); H05K 2203/086 (2013.01); H05K 2203/087 (2013.01); H05K 2203/095 (2013.01); H05K 2203/1476 (2013.01);
Abstract

A method for protecting a substrate from corrosion, which method comprises in sequence: a first step including plasma polymerization of a precursor monomer and deposition of the resultant polymer onto at least one surface of a substrate; a second step including exposing the polymer to an inert gas in the presence of a plasma without further deposition of polymer onto the or each surface of the substrate; a third step including plasma polymerization of the precursor monomer used in the first step and deposition of the resultant polymer onto the polymer deposited in the first step so as to increase the thickness of the polymer; and optionally, a fourth step including exposing the polymer to an inert gas in the presence of a plasma without further deposition of polymer onto the or each surface of the substrate.


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