The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 16, 2022
Filed:
Aug. 12, 2019
Murata Manufacturing Co., Ltd., Kyoto, JP;
Kazushige Sato, Kyoto, JP;
Jun Kashirajima, Kyoto, JP;
Yuya Eshita, Kyoto, JP;
Nobumitsu Amachi, Kyoto, JP;
MURATA MANUFACTURING CO., LTD., Kyoto, JP;
Abstract
A circuit module () includes a substrate (), on one principal surface of which a first wiring pattern () is provided, first electronic components (-) constituting a first electronic circuit together with the first wiring pattern (), a plurality of connection conductors (), a plurality of external connection terminals, a first resin layer (), and a second resin layer (). At least one of the plurality of connection conductors () includes a first columnar conductor () extending in a normal line direction of the one principal surface of the substrate (), and a plate-like conductor () extending in a direction parallel to the one principal surface of the substrate (). At least one of the plurality of external connection terminals is a second columnar conductor () extending in the normal line direction of the one principal surface of the substrate ().