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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11419210 B1

PDFFull Text
Date of Patent:
Aug. 16, 2022

Filed:

Apr. 24, 2013

Resin composition, metal foil provided with resin layer, metal clad laminate, and printed wiring board

Applicant:

Mitsui Mining & Smelting Co., Ltd., Tokyo, JP;

Inventors:

Toshifumi Matsushima, Saitama, JP;

Tetsuro Sato, Saitama, JP;

Assignee:

MITSUI MINING & SMELTING CO., LTD., Tokyo, JP;

Attorney:

Greenblum & Bernstein, PLC

Primary Examiner:

Vivian Chen

Int. Cl.
CPC ...
H05K 1/05 (2006.01); C08L 71/12 (2006.01); C08L 53/02 (2006.01); H05K 1/03 (2006.01); H05K 3/02 (2006.01); C08K 3/20 (2006.01); C08K 3/22 (2006.01); C08K 3/013 (2018.01); C08L 47/00 (2006.01); C08K 5/37 (2006.01); C08K 5/01 (2006.01);
U.S. Cl.
CPC ...
H05K 1/056 (2013.01); C08L 53/02 (2013.01); C08L 71/12 (2013.01); H05K 1/0326 (2013.01); C08K 3/013 (2018.01); C08K 3/20 (2013.01); C08K 5/01 (2013.01); C08K 5/37 (2013.01); C08K 2003/2206 (2013.01); C08K 2003/2237 (2013.01); C08L 47/00 (2013.01); C08L 2203/20 (2013.01); H05K 1/0353 (2013.01); H05K 1/0373 (2013.01); H05K 3/022 (2013.01); H05K 2201/0137 (2013.01); H05K 2201/0145 (2013.01); H05K 2201/0209 (2013.01); H05K 2201/0355 (2013.01); H05K 2201/0358 (2013.01); Y10T 428/24917 (2015.01); Y10T 428/31696 (2015.04);
Abstract

An object of the present invention is to provide a resin composition which enables formation of a resin layer having excellent electrical performance including high frequency performance and appropriate solubility with desmear solution required on a material used in manufacturing of a printed wiring board. To achieve the object, the resin composition used for constituting a resin layer on a metal layer surface of a laminate includes a polyphenylene ether compound and 10 parts by mass to 100 parts by mass of a styrene-butadiene block copolymer and 0.1 parts by mass to 100 parts by mass of a component promoting solubility with desmear solution against 100 parts by mass of the polyphenylene ether compound.

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