The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 16, 2022
Filed:
Mar. 04, 2021
Applicant:
Htc Corporation, Taoyuan, TW;
Inventor:
Che-Jung Chang, Taoyuan, TW;
Assignee:
HTC Corporation, Taoyuan, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/14 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H05K 1/025 (2013.01); H05K 1/144 (2013.01); H01L 25/0657 (2013.01); H01L 2225/06572 (2013.01); H05K 2201/09281 (2013.01); H05K 2201/09672 (2013.01);
Abstract
A circuit board structure and a layout structure thereof are proposed. The layout structure includes at least one signal transmission line, at least one bonding pad, and at least one impedance adjusting wire. The signal transmission line, the bonding pad, and the impedance adjusting wire are disposed on a first circuit board. The impedance adjusting wire is electrically connected between the signal transmission line and the bonding pad. The impedance adjusting wire is disposed along a periphery of the bonding pad, and at least partially surrounds the bonding pad.