The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 16, 2022

Filed:

Jan. 22, 2020
Applicant:

Stmicroelectronics S.r.l., Agrate Brianza, IT;

Inventors:

Fabrizio Cerini, Magenta, IT;

Enri Duqi, Milan, IT;

Silvia Adorno, Novate Milanese, IT;

Lorenzo Baldo, Bareggio, IT;

Assignee:

STMICROELECTRONICS S.r.l., Agrate Brianza, IT;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04R 19/00 (2006.01); H04R 19/02 (2006.01); B81B 3/00 (2006.01); B81C 1/00 (2006.01); H04R 1/02 (2006.01); H04R 17/00 (2006.01); H04R 31/00 (2006.01);
U.S. Cl.
CPC ...
H04R 19/02 (2013.01); B81B 3/0051 (2013.01); B81C 1/0015 (2013.01); H04R 1/025 (2013.01); H04R 17/00 (2013.01); H04R 19/005 (2013.01); H04R 31/006 (2013.01); B81B 2201/0257 (2013.01); B81B 2203/0118 (2013.01); B81B 2203/0127 (2013.01); B81B 2203/0315 (2013.01); B81C 2201/0116 (2013.01); B81C 2201/0133 (2013.01); B81C 2201/0178 (2013.01); H04R 2201/003 (2013.01); H04R 2400/11 (2013.01);
Abstract

An actuation structure of a MEMS electroacoustic transducer is formed in a die of semiconductor material having a monolithic body with a front surface and a rear surface extending in a horizontal plane x-y plane and defined in which are: a frame; an actuator element arranged in a central opening defined by the frame; cantilever elements, coupled at the front surface between the actuator element and the frame; and piezoelectric regions arranged on the cantilever elements and configured to be biased to cause a deformation of the cantilever elements by the piezoelectric effect. A first stopper arrangement is integrated in the die and configured to interact with the cantilever elements to limit a movement thereof in a first direction of a vertical axis orthogonal to the horizontal plane, x-y plane towards the underlying central opening.


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