The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 16, 2022

Filed:

Apr. 01, 2020
Applicant:

Murata Manufacturing Co., Ltd., Kyoto, JP;

Inventors:

Yoshihiro Daimon, Kyoto, JP;

Kenji Tahara, Kyoto, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03F 3/191 (2006.01); H03F 3/24 (2006.01); H03F 3/195 (2006.01); H03F 3/21 (2006.01); H04B 1/04 (2006.01); H03F 1/56 (2006.01);
U.S. Cl.
CPC ...
H03F 3/245 (2013.01); H03F 1/565 (2013.01); H03F 3/195 (2013.01); H03F 3/211 (2013.01); H04B 1/0458 (2013.01); H03F 2200/294 (2013.01); H03F 2200/318 (2013.01); H03F 2200/451 (2013.01);
Abstract

A first power amplifier amplifies first transmission signals in a first frequency band and outputs the resultant signals. A first matching circuit includes a plurality of first inductor portions and is connected to an output pad electrode of the first power amplifier. A second power amplifier amplifies second transmission signals in a second frequency band higher than the first frequency band and outputs the resultant signals. A second matching circuit includes at least one second inductor portion and is connected to an output side of the second power amplifier. A multilayer substrate has a first main surface and a second main surface located opposite to each other and is provided with the first and second power amplifiers and the first and second matching circuits. The first inductor portion closer than the other first inductor portions to the output pad electrode includes an inner-layer inductor portion located in the multilayer substrate.


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