The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 16, 2022
Filed:
May. 18, 2017
Applicant:
Sony Semiconductor Solutions Corporation, Kanagawa, JP;
Inventor:
Shinichi Agatuma, Miyagi, JP;
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORPORATION, Kanagawa, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01S 5/024 (2006.01); H01S 5/023 (2021.01); H01S 5/02 (2006.01); H01S 5/0237 (2021.01);
U.S. Cl.
CPC ...
H01S 5/02469 (2013.01); H01S 5/023 (2021.01); H01S 5/0216 (2013.01); H01S 5/0237 (2021.01);
Abstract
Provided is an element structure includes a heat dissipation member and a support member provided on the heat dissipation member. The support member includes a first mount material, a stress relaxation layer, and a second mount material in a stacking direction. The element structure further includes a functional element provided on the support member.