The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 16, 2022

Filed:

Apr. 27, 2020
Applicant:

Microsoft Technology Licensing, Llc, Redmond, WA (US);

Inventor:

Christopher A. Cantaloube, Boca Raton, FL (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 39/04 (2006.01); H01L 23/00 (2006.01); H01L 27/18 (2006.01); H01L 39/02 (2006.01); H01L 39/22 (2006.01); H01L 39/24 (2006.01);
U.S. Cl.
CPC ...
H01L 39/045 (2013.01); H01L 24/08 (2013.01); H01L 24/80 (2013.01); H01L 27/18 (2013.01); H01L 39/025 (2013.01); H01L 39/223 (2013.01); H01L 39/2493 (2013.01); H01L 2224/08146 (2013.01); H01L 2224/80895 (2013.01); H01L 2224/80896 (2013.01);
Abstract

An integrated circuit is provided that comprises a first substrate having a plurality of conductive contact pads spaced apart from one another on a surface of the first substrate, a dielectric layer overlying the first substrate and the plurality of conductive contact pads, and a second substrate overlying the dielectric layer. A plurality of superconducting contacts extend through the second substrate and the dielectric layer to the first substrate, wherein each superconducting contact of the plurality of superconducting contacts is aligned with and in contact with a respective conductive contact pad of the plurality of conductive contact pads.


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