The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 16, 2022

Filed:

Aug. 24, 2020
Applicant:

Nichia Corporation, Anan, JP;

Inventors:

Kiyoshi Kayama, Anan, JP;

Shohei Mori, Anan, JP;

Akinobu Maeda, Tokushima, JP;

Assignee:

NICHIA CORPORATION, Anan, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/56 (2010.01); H01L 33/60 (2010.01); H01L 33/62 (2010.01); H01L 33/48 (2010.01); H01L 25/16 (2006.01);
U.S. Cl.
CPC ...
H01L 33/56 (2013.01); H01L 33/60 (2013.01); H01L 33/62 (2013.01);
Abstract

A light emitting device includes: a resin package including first and second leads, and a resin part defining a recess defined by a lateral wall and an upward-facing surface, which includes an upper surface of a portion of each of the first lead, the second lead, and the resin part; and a light emitting element on the first lead. The resin part includes a holding resin portion between the first and second leads at the upward-facing surface, and a covering resin portion that covers a portion of the upper surface of the holding resin portion and a portion of an upper surface of at least one of the first and second leads. A portion of an upper surface of the holding resin portion is exposed from the covering resin portion, and is located on the same plane as the upper surfaces of the first and second leads.


Find Patent Forward Citations

Loading…