The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 16, 2022
Filed:
Aug. 07, 2020
Semileds Corporation, Chu-Nan, TW;
Shin-etsu Chemical Co., Ltd., Tokyo, JP;
Chen-Fu Chu, Hsinchu, TW;
Shih-Kai Chan, Miaoli County, TW;
Yi-Feng Shih, Miaoli County, TW;
David Trung Doan, Hsinchu County, TW;
Trung Tri Doan, Hsinchu County, TW;
Yoshinori Ogawa, Kanagawa, JP;
Kohei Otake, Gunma, JP;
Kazunori Kondo, Gunma, JP;
Keiji Ohori, Saitama-shi, JP;
Taichi Kitagawa, Gunma, JP;
Nobuaki Matsumoto, Gunma, JP;
Toshiyuki Ozai, Gunma, JP;
Shuhei Ueda, Niigata, JP;
SemiLEDs Corporation, Chu-nan, TW;
Shin-Etsu Chemical Co., Ltd., Tokyo, JP;
Abstract
A method for fabricating light emitting diode (LED) dice includes the steps of: providing a substrate, and forming a plurality of die sized semiconductor structures on the substrate. The method also includes the steps of providing a receiving plate having an elastomeric polymer layer, placing the substrate and the receiving plate in physical contact with an adhesive force applied by the elastomeric polymer layer, and performing a laser lift-off (LLO) process by directing a uniform laser beam through the substrate to the semiconductor layer at an interface with the substrate to lift off the semiconductor structures onto the elastomeric polymer layer. During the laser lift-off (LLO) process the elastomeric polymer layer functions as a shock absorber to reduce momentum transfer, and as an adhesive surface to hold the semiconductor structures in place on the receiving plate.