The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 16, 2022
Filed:
Jun. 17, 2019
Applicant:
Wuhan China Star Optoelectronics Technology Co., Ltd., Wuhan, CN;
Inventor:
Yong Yang, Wuhan, CN;
Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 33/0093 (2020.05); H01L 24/83 (2013.01); H01L 2224/83815 (2013.01); H01L 2924/12041 (2013.01);
Abstract
A die-bonding method and a spraying device for an LED include: providing a substrate provided with a pad and a white oil layer covering wiring, placing a steel mesh on the substrate, and then spraying suspension containing solder paste on the pad by the spraying device, to form a solder paste film layer. Finally, a reflow process for the solder is performed. The solder paste is prepared on the pad by spraying, so that a crystal wafer is prevented from being tilted or short-circuited due to pulling or dragging of the solder paste during the reflow process for the solder, thereby improving uneven brightness of the surface light source.