The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 16, 2022

Filed:

Mar. 19, 2020
Applicant:

Facebook Technologies, Llc, Menlo Park, CA (US);

Inventors:

Ali Sengül, Zurich, CH;

Zheng Sung Chio, Cork, IE;

Daniel Brodoceanu, Cork, IE;

Oscar Torrents Abad, Cork, IE;

Jeb Wu, Redmond, WA (US);

Tennyson Nguty, Cork, IE;

Assignee:

Meta Platforms Technologies, LLC, Menlo Park, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/62 (2010.01); H01L 21/683 (2006.01); H01L 25/075 (2006.01); H01L 33/32 (2010.01); G01R 31/20 (2006.01); G01R 1/067 (2006.01); H01L 33/00 (2010.01);
U.S. Cl.
CPC ...
H01L 33/0054 (2013.01); H01L 25/0753 (2013.01); H01L 33/0095 (2013.01);
Abstract

A light emitting diode (LED) array is formed by bonding an LED substrate to a backplane substrate via fitted nanotube interconnects. The backplane substrate may include circuits for driving the LED array. The LED substrate may be a chip or wafer, and may include one or more LED devices. The LED substrate is positioned above the backplane substrate, such that a LED device of the LED substrate is aligned to a corresponding circuit in the backplane substrate. Each of the fitted interconnects electrically connect a LED device to the corresponding circuit of the backplane substrate.


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