The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 16, 2022
Filed:
May. 25, 2016
Applicant:
Sony Corporation, Tokyo, JP;
Inventors:
Hidetsugu Otani, Kumamoto, JP;
Yuuji Kishigami, Kumamoto, JP;
Assignee:
SONY CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/146 (2006.01); H04N 5/225 (2006.01); H01L 23/00 (2006.01); H01L 31/0203 (2014.01); H01L 31/0232 (2014.01); H01L 31/024 (2014.01); H04N 5/369 (2011.01);
U.S. Cl.
CPC ...
H01L 27/14618 (2013.01); H01L 24/48 (2013.01); H01L 24/85 (2013.01); H01L 27/14625 (2013.01); H01L 27/14636 (2013.01); H01L 27/14683 (2013.01); H01L 31/0203 (2013.01); H01L 31/024 (2013.01); H01L 31/02325 (2013.01); H04N 5/2253 (2013.01); H04N 5/22521 (2018.08); H04N 5/369 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48106 (2013.01); H01L 2224/48225 (2013.01);
Abstract
Provided is a module including an organic substrate, an image sensor mounted on an upper surface of the organic substrate, a wire connecting the image sensor and the organic substrate, and a wire sealing unit adhered to a side surface of the image sensor while encompassing the wire. A thermal conductivity of the wire sealing unit is higher than a thermal conductivity of the organic substrate.