The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 16, 2022
Filed:
Sep. 11, 2018
Sony Semiconductor Solutions Corporation, Kanagawa, JP;
SONY SEMICONDUCTOR SOLUTIONS CORPORATION, Kanagawa, JP;
Abstract
The present technology relates to a semiconductor device that makes it possible to enhance a heat dissipation capacity without occurrence of a fluctuation in high frequency characteristics. A glass substrate is adhered to a wiring layer-attached glass substrate, and a heat dissipation part is formed between the wiring layer-attached glass substrate and the glass substrate. The present disclosure is applicable to, for example, a high-frequency module and a high-speed communication module.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile