The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 16, 2022

Filed:

Jun. 27, 2019
Applicant:

Kyocera Corporation, Kyoto, JP;

Inventors:

Takayuki Kimura, Omihachiman, JP;

Hisaki Masuda, Hikone, JP;

Takayuki Ohyama, Higashine, JP;

Yuko Tanaka, Kyoto, JP;

Yoshihiro Uemura, Moriyama, JP;

Hiroyuki Miura, Moriyama, JP;

Assignee:

KYOCERA CORPORATION, Kyoto, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/06 (2006.01); H01L 23/10 (2006.01);
U.S. Cl.
CPC ...
H01L 23/06 (2013.01); H01L 23/10 (2013.01);
Abstract

A board in an aspect of the present invention includes a substrate, a first film, a first layer, and a second film. The substrate has a first elastic modulus. The first film is at an upper surface of the substrate. The first layer is at a lower surface of the substrate. The first layer has a second elastic modulus lower than the first elastic modulus and has a first thermal expansion coefficient. The second film is at a lower surface of the first layer. The second film includes the same material as the first film and has a second thermal expansion coefficient lower than the first thermal expansion coefficient.


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