The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 16, 2022

Filed:

Mar. 09, 2017
Applicant:

Fuji Corporation, Chiryu, JP;

Inventors:

Yukinori Nakayama, Hekinan, JP;

Shinichi Fujii, Kariya, JP;

Assignee:

FUJI CORPORATION, Chiryu, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/67 (2006.01); H01L 21/683 (2006.01); G05B 19/418 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67144 (2013.01); G05B 19/4183 (2013.01); H01L 21/67276 (2013.01); H01L 21/6836 (2013.01); G05B 2219/36195 (2013.01); H01L 2221/68327 (2013.01);
Abstract

A component mounting machine includes a control device that controls a wafer supply device and a component transfer device. The control device includes a die information storage section storing the position of the dies stored in the wafer supply device associated with a rank of the dies, a block information acquisition section acquiring the condition of the dies to be mounted on a block provided on a board, a rank designation section designating the rank of the die to be picked up by the component transfer device, and a position designation section designating the position of the die to be picked up by the component transfer device. The position designation section designates the position of the die so that the die having the rank designated by the rank designation section is continuously picked up over the multiple wafers stored in the wafer supply device.


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