The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 16, 2022
Filed:
May. 22, 2020
Applicant:
Infineon Technologies Ag, Neubiberg, DE;
Inventors:
Thai Kee Gan, Melaka, MY;
Edmund Sales Cabatbat, Roxas, PH;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 21/673 (2006.01);
U.S. Cl.
CPC ...
H01L 21/4825 (2013.01); H01L 21/565 (2013.01); H01L 21/67356 (2013.01);
Abstract
A semiconductor package includes a die pad, a die, a first lead, a plurality of second leads, and a mold material. The die is electrically coupled to the die pad. The first lead is electrically coupled to the die. The plurality of second leads are electrically coupled to the die. The plurality of second leads are adjacent to the first lead. The mold material encapsulates at least a portion of the die pad, the die, the first lead, and the plurality of second leads. Each of the plurality of second leads extends a farther distance from the mold material than the first lead.