The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 16, 2022
Filed:
Jun. 11, 2021
Massachusetts Institute of Technology, Cambridge, MA (US);
Commonwealth Fusion Systems Llc, Cambridge, MA (US);
Brian Labombard, Belmont, MA (US);
Robert S. Granetz, Newton, MA (US);
James Irby, Natick, MA (US);
Rui Vieira, Billerica, MA (US);
William Beck, Watertown, MA (US);
Daniel Brunner, Cambridge, MA (US);
Jeffrey Doody, Melrose, MA (US);
Martin Greenwald, Belmont, MA (US);
Zachary Hartwig, Jamaica Plain, MA (US);
Philip Michael, Cambridge, MA (US);
Robert Mumgaard, Boston, MA (US);
Alexey Radovinsky, Cambridge, MA (US);
Syun'ichi Shiraiwa, Acton, MA (US);
Brandon N. Sorbom, Cambridge, MA (US);
John Wright, Melrose, MA (US);
Lihua Zhou, Woburn, MA (US);
Massachusetts Institute of Technology, Cambridge, MA (US);
Commonwealth Fusion Systems LLC, Cambridge, MA (US);
Abstract
Described herein are concepts, system and techniques which provide a means to construct robust high-field superconducting magnets using simple fabrication techniques and modular components that scale well toward commercialization. The resulting magnet assembly—which utilizes non-insulated, high temperature superconducting tapes (HTS) and provides for optimized coolant pathways—is inherently strong structurally, which enables maximum utilization of the high magnetic fields available with HTS technology. In addition, the concepts described herein provide for control of quench-induced current distributions within the tape stack and surrounding superstructure to safely dissipate quench energy, while at the same time obtaining acceptable magnet charge time. The net result is a structurally and thermally robust, high-field magnet assembly that is passively protected against quench fault conditions.