The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 16, 2022
Filed:
May. 11, 2021
Micro-star International Co., Ltd., New Taipei, TW;
Msi Computer (Shenzhen) Co., Ltd, Guangdong, CN;
Yu An Wang, New Taipei, TW;
Chun Mo Wu, New Taipei, TW;
Chih-Shiang Hsu, Taipei, TW;
Wei En Kao, New Taipei, TW;
Shuan-Cheng Su, New Taipei, TW;
Kung Ming Shen, New Taipei, TW;
Chia Chun Lin, New Taipei, TW;
Chung-Bi Lee, Taoyuan, TW;
Huan-Jung Lee, New Taipei, TW;
Cheng-Lung Chen, New Taipei, TW;
Chia Hao Yeh, New Taipei, TW;
Micro-Star International Co., Ltd., New Taipei, TW;
MSI Computer (Shenzhen) Co., Ltd, Guangdong, CN;
Abstract
A heat dissipation system of a portable electronic device including a first processing element, a second processing element, a heat dissipation module located between the first processing element and the second processing element, a first heat transferring member, and a second heat transferring member, is provided. The first processing element has a first region and a second region. The first heat transferring member is in thermal contact with the first region, the second processing element, and the heat dissipation module. The second heat transferring member is in thermal contact with the second region and the heat dissipation module.