The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 16, 2022

Filed:

Oct. 24, 2019
Applicant:

Coretronic Corporation, Hsin-Chu, TW;

Inventors:

Chia-Lun Tsai, Hsin-Chu, TW;

Chi-Tang Hsieh, Hsin-Chu, TW;

Assignee:

Coretronic Corporation, Hsin-Chu, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F21K 9/64 (2016.01); H01L 33/50 (2010.01); G03B 21/20 (2006.01); F21V 9/08 (2018.01);
U.S. Cl.
CPC ...
F21K 9/64 (2016.08); F21V 9/08 (2013.01); G03B 21/2006 (2013.01); G03B 21/2066 (2013.01); H01L 33/505 (2013.01); H01L 33/508 (2013.01);
Abstract

A wavelength-converting device has a light incident side. The wavelength-converting device includes an inner annular portion and an annular portion. The annular portion is connected to an outer edge of the inner annular portion. The annular portion includes a wavelength-converting portion, a first heat-conductive bonding medium, a reflective layer, and a wavelength-converting layer. A groove is annularly disposed in the wavelength-converting portion, and the groove is recessed from the light incident side of the wavelength-converting device. The first heat-conductive bonding medium is disposed in the groove. The reflective layer is disposed on the first heat-conductive bonding medium. The wavelength-converting layer is disposed on the reflective layer and has a light receiving surface. A projection apparatus is also provided.


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