The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 16, 2022
Filed:
Jun. 18, 2018
Applicant:
Toyo Seikan Group Holdings, Ltd., Tokyo, JP;
Inventors:
Kouji Nanbu, Kudamatsu, JP;
Toshihiko Miyazaki, Osaka, JP;
Hirohisa Masuda, Osaka, JP;
Hiroshi Shimomura, Osaka, JP;
Assignee:
TOYO SEIKAN GROUP HOLDINGS. LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 15/04 (2006.01); C23C 28/00 (2006.01); C03C 3/145 (2006.01); C03C 8/04 (2006.01); C03C 8/16 (2006.01); C23C 8/12 (2006.01); C23D 5/02 (2006.01); C25D 3/12 (2006.01); C25D 5/50 (2006.01); H01L 51/00 (2006.01);
U.S. Cl.
CPC ...
C23C 28/345 (2013.01); C03C 3/145 (2013.01); C03C 8/04 (2013.01); C03C 8/16 (2013.01); C23C 8/12 (2013.01); C23D 5/02 (2013.01); C25D 3/12 (2013.01); C25D 5/50 (2013.01); H01L 51/0097 (2013.01); Y10T 428/12611 (2015.01);
Abstract
A substrate for a flexible device which includes a stainless steel sheet, a nickel plating layer formed on a surface of the stainless steel sheet, and a glass layer of electrical insulating bismuth-based glass formed in the form of layer on a surface of the nickel plating layer.