The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 16, 2022

Filed:

Mar. 21, 2018
Applicant:

Northwestern University, Evanston, IL (US);

Inventors:

Qian Wang, Mount Prospect, IL (US);

Yip-Wah Chung, Wilmette, IL (US);

Kornel F. Ehmann, Evanston, IL (US);

Xingliang He, Evanston, IL (US);

Yi Shi, Evanston, IL (US);

Zhong Liu, Evanston, IL (US);

Assignee:

Northwestern University, Evanston, IL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C21D 1/00 (2006.01); C21D 1/06 (2006.01); B05B 1/02 (2006.01); B82Y 30/00 (2011.01); C23C 24/04 (2006.01);
U.S. Cl.
CPC ...
C21D 1/06 (2013.01); B05B 1/02 (2013.01); B82Y 30/00 (2013.01); C23C 24/04 (2013.01);
Abstract

In an embodiment, a method of hardening a surface of a substrate comprises directing a waterjet having a transition flow region, the waterjet comprising water and particles, at a surface of a substrate such that the waterjet impacts the surface within the transition flow region to provide a layer of embedded particles underneath the surface of the substrate, thereby forming a hardened substrate. The hardened substrates are also provided.


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