The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 16, 2022

Filed:

Oct. 07, 2020
Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Alfred Sigl, Sinzing, DE;

Wolfgang Friza, Villach, AT;

Stefan Geissler, Regensburg, DE;

Assignee:

INFINEON TECHNOLOGIES AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B81C 1/00 (2006.01); H01L 21/311 (2006.01); H01L 21/677 (2006.01); H01L 23/00 (2006.01); H04R 19/00 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
B81C 1/00349 (2013.01); B81C 1/00182 (2013.01); B81C 1/00523 (2013.01); H01L 21/311 (2013.01); H01L 21/67763 (2013.01); H01L 24/94 (2013.01); H04R 19/005 (2013.01); B81B 2201/0257 (2013.01); B81C 2201/0194 (2013.01); H01L 2924/1461 (2013.01);
Abstract

A method for producing a thin-film layer includes providing a layer stack on a carrier substrate, wherein the layer stack includes a carrier layer and a sacrificial layer, and wherein the sacrificial layer includes areas in which the carrier layer is exposed. The method includes providing the thin-film layer on the layer stack, such that the thin-film layer bears on the sacrificial layer and, in the areas of the sacrificial layer in which the carrier layer is exposed, against the carrier layer. The method includes at least partly removing the sacrificial layer from the thin-film layer in order to eliminate a contact between the thin-film layer and the sacrificial layer in some areas. The method also includes detaching the thin-film layer from the carrier layer.


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