The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 16, 2022

Filed:

Feb. 05, 2020
Applicant:

Canon Kabushiki Kaisha, Tokyo, JP;

Inventor:

Hitoshi Murao, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 64/153 (2017.01); B29C 64/264 (2017.01); B29C 64/218 (2017.01); B29C 64/393 (2017.01); B29C 64/245 (2017.01); B33Y 50/02 (2015.01); B33Y 10/00 (2015.01); B33Y 30/00 (2015.01);
U.S. Cl.
CPC ...
B29C 64/153 (2017.08); B29C 64/218 (2017.08); B29C 64/245 (2017.08); B29C 64/264 (2017.08); B29C 64/393 (2017.08); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B33Y 50/02 (2014.12);
Abstract

An additive manufacturing apparatus includes a base, a layer forming portion configured to form a powder layer having a predetermined thickness by moving in a space above the base, an irradiation portion configured to irradiate the powder layer with an energy beam, a detection portion configured to detect a projecting portion formed on a solidified portion and a position of the projecting portion, and a control unit. The solidified portion is formed by irradiating the powder layer with the energy beam from the irradiation portion. A height of the projecting portion is larger than the predetermined thickness. The layer forming portion includes a high-rigidity thickness-determining portion and a low-rigidity thickness-determining portion. The control unit is configured to control operation of the high-rigidity thickness-determining portion and the low-rigidity thickness-determining portion, depending on a detection result by the detection portion.


Find Patent Forward Citations

Loading…