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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11413804 B1

PDFFull Text
Date of Patent:
Aug. 16, 2022

Filed:

Feb. 06, 2018

Method and apparatus for embossing a substrate

Applicant:

Xerox Corporation, Norwalk, CT (US);

Inventors:

Seemit Praharaj, Webster, NY (US);

Michael Jon Levy, Webster, NY (US);

Anthony S. Condello, Webster, NY (US);

Assignee:

Xerox Corporation, Norwalk, CT (US);

Attorney:
Primary Examiner:

Abbas Rashid

Assistant Examiner:

Wayne K Swier

Int. Cl.
CPC ...
B29C 59/04 (2006.01); B29C 33/38 (2006.01); B41J 2/01 (2006.01); D06C 23/04 (2006.01); B29C 33/40 (2006.01); B41M 5/00 (2006.01); B41M 7/00 (2006.01); B31F 1/07 (2006.01); B29C 33/72 (2006.01); B29C 35/08 (2006.01);
U.S. Cl.
CPC ...
B29C 59/046 (2013.01); B29C 33/3842 (2013.01); B29C 33/405 (2013.01); B29C 33/72 (2013.01); B31F 1/07 (2013.01); B41J 2/01 (2013.01); B41M 5/0088 (2013.01); B41M 7/0081 (2013.01); D06C 23/04 (2013.01); B29C 2035/0827 (2013.01); B29K 2821/00 (2013.01); B29K 2901/00 (2013.01); B29K 2995/0062 (2013.01); B31F 2201/0753 (2013.01); B31F 2201/0792 (2013.01);
Abstract

An apparatus and method for embossing a substrate are disclosed. For example, the apparatus includes an embossing platform, a printhead to dispense ink on the embossing platform in a desired raised pattern on the embossing platform, a press to apply a load against a substrate placed on the desired raised pattern and the embossing platform to emboss the desired raised pattern onto the substrate, and an ink removal device to remove the ink that is dispensed on the embossing platform in the desired raised pattern.

Find Patent Forward Citations

Praharaj, Seemit. (2022). Method and apparatus for embossing a substrate (U.S. Patent No. 11413804). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11413804

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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