The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 16, 2022
Filed:
Mar. 22, 2018
Applicant:
Honda Motor Co., Ltd., Tokyo, JP;
Inventors:
Ryan M. Hahnlen, Dublin, OH (US);
Benjamin Adam Hoffman, Marysville, OH (US);
Assignee:
HONDA MOTOR CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 45/72 (2006.01); B29C 45/26 (2006.01); B29C 45/40 (2006.01); B29C 33/38 (2006.01); B33Y 10/00 (2015.01); B33Y 80/00 (2015.01); B29C 64/10 (2017.01); B29L 31/00 (2006.01);
U.S. Cl.
CPC ...
B29C 45/7207 (2013.01); B29C 33/3842 (2013.01); B29C 45/2673 (2013.01); B29C 45/40 (2013.01); B29C 64/10 (2017.08); B33Y 10/00 (2014.12); B33Y 80/00 (2014.12); B29K 2901/10 (2013.01); B29K 2995/0013 (2013.01); B29L 2031/757 (2013.01);
Abstract
A reusable mold for injection molding and molding method includes a reusable mold member, a mold cavity defined in the mold member, and at least one heat sink recess defined in the mold member for accommodating a heat sink material therein for rapidly removing heat from the mold cavity when the mold member is used to injection mold a molded part. The reusable mold injection molds a molded part and rapidly removes heat from the mold cavity via a heat sink material accommodated in the at least one heat sink recess.