The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 09, 2022

Filed:

Mar. 23, 2018
Applicant:

Fuji Corporation, Chiryu, JP;

Inventors:

Hidenori Goto, Anjo, JP;

Ryohei Kamio, Okazaki, JP;

Kota Niwa, Okazaki, JP;

Kohei Sugihara, Nishio, JP;

Assignee:

FUJI CORPORATION, Chiryu, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B25J 9/16 (2006.01); H05K 13/04 (2006.01); H05K 13/08 (2006.01); B25J 13/08 (2006.01); B25J 9/02 (2006.01);
U.S. Cl.
CPC ...
H05K 13/0413 (2013.01); B25J 9/1612 (2013.01); B25J 9/1687 (2013.01); B25J 9/1697 (2013.01); B25J 13/08 (2013.01); H05K 13/0408 (2013.01); H05K 13/0812 (2018.08); B25J 9/026 (2013.01); H05K 13/0813 (2018.08);
Abstract

A component mounting device is capable of mounting a component having a feature portion on an upper surface, on a board. The component mounting device picks up a component by a pickup member and loads the picked-up component on a temporary loading stand at an angle substantially equal to a target mounting angle to the board. Subsequently, the component mounting device images the upper surface of the loaded component by an upper imaging device and picks up again the loaded component. Then, the component mounting device mounts the component picked up again at the target mounting angle at the target mounting position corrected based on the positional deviation amount of the feature portion recognized by the upper surface image of the imaged upper surface.


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