The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 09, 2022
Filed:
Jul. 11, 2019
Applicant:
International Business Machines Corporation, Armonk, NY (US);
Inventors:
Samuel Connor, Apex, NC (US);
Stuart B. Benefield, Durham, NC (US);
Matthew S. Doyle, Chatfield, MN (US);
Joseph Kuczynski, North Port, FL (US);
Jonathan Jackson, Cedar Grove, NC (US);
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 1/02 (2006.01); H05K 1/09 (2006.01); H05K 3/42 (2006.01); H05K 3/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/115 (2013.01); H05K 1/0251 (2013.01); H05K 1/09 (2013.01); H05K 3/0047 (2013.01); H05K 3/42 (2013.01); H05K 2201/09681 (2013.01); H05K 2203/163 (2013.01); H05K 2203/173 (2013.01);
Abstract
Methods and structures are provided for implementing embedded wire repair for printed circuit board (PCB) constructs. A repair wire layer is provided within the PCB stack with reference planes on opposite sides of the repair wire layer. When a repair connection is required, an appropriate plated through hole (PTH) is drilled to form the repair connection using the repair wire layer.