The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 09, 2022

Filed:

Dec. 05, 2019
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Hamid R. Sheikh, Allen, TX (US);

Youngjun Yoo, Plano, TX (US);

John Seokjun Lee, Allen, TX (US);

Michael O. Polley, Garland, TX (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04N 5/232 (2006.01); H04N 5/225 (2006.01); H04N 5/262 (2006.01); H04N 5/222 (2006.01); H04N 5/235 (2006.01); H04N 5/341 (2011.01);
U.S. Cl.
CPC ...
H04N 5/23238 (2013.01); H04N 5/2258 (2013.01); H04N 5/23245 (2013.01); H04N 5/23299 (2018.08); H04N 5/2621 (2013.01);
Abstract

A method includes, in a first mode, positioning first and second tiltable image sensor modules of an image sensor array of an electronic device so that a first optical axis of the first tiltable image sensor module and a second optical axis of the second tiltable image sensor module are substantially perpendicular to a surface of the electronic device, and the first and second tiltable image sensor modules are within a thickness profile of the electronic device. The method also includes, in a second mode, tilting the first and second tiltable image sensor modules so that the first optical axis of the first tiltable image sensor module and the second optical axis of the second tiltable image sensor module are not perpendicular to the surface of the electronic device, and at least part of the first and second tiltable image sensor modules are no longer within the thickness profile of the electronic device.


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