The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 09, 2022

Filed:

Mar. 24, 2016
Applicant:

Lawrence Livermore National Security, Llc, Livermore, CA (US);

Inventors:

Susant Patra, Brentwood, CA (US);

Robert J. Deri, Pleasanton, CA (US);

John W. Elmer, Danville, CA (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01S 5/024 (2006.01); H01S 5/02 (2006.01); H01S 5/323 (2006.01); H01L 23/522 (2006.01); H01L 23/532 (2006.01); H01S 5/40 (2006.01);
U.S. Cl.
CPC ...
H01S 5/02469 (2013.01); H01L 23/5226 (2013.01); H01L 23/53228 (2013.01); H01S 5/021 (2013.01); H01S 5/024 (2013.01); H01S 5/0206 (2013.01); H01S 5/32316 (2013.01); H01S 5/02423 (2013.01); H01S 5/4025 (2013.01);
Abstract

A Cu—Si—Cu substrate having a silicon substrate, copper plating on opposite sides of the silicon substrate, and copper vias extending thru the silicon substrate to electrically and thermally connect the copper platings together. The thicknesses of the silicon substrate and the copper platings are selected so that a coefficient of thermal expansion (CTE) of the Cu—Si—Cu substrate is substantially the same as a CTE of a material to be mounted on the Cu—Si—Cu substrate.


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